ABI Research, using the teardown expertise of System Plus Consulting, unpacked nine leading second-generation 5G smartphones to discover that RF Front End (RFFE) content is evidently moving to full level integrated modem-RF system designs, which will be the key to success as the market advances to wider 5G adoption.
“The 5G smartphone market is set to rapidly expand in the next 12 months, with many mobile vendors looking to quickly develop their 5G portfolios. However, a host of extremely complex challenges lie ahead for smartphone vendors, which they must overcome to fully realize the 5G demand explosion across all tiers,” states David McQueen, Research Director at ABI Research.
The move to 5G requires an integration of the entire 5G cellular system design into OEMs’ devices, from modem-to-antenna, addressing all aspects of end-to-end performance. This complexity level includes the integration and deployment of new 5G modem and RFFE components, features, and functionalities, leading to substantial changes in the design of mobile devices. “Smartphone OEMs are finding this change particularly challenging, as it makes their RFFE component procurement process and system design far more complex than ever. Unless adequately addressed, the burden brought about by the complexities of implementing 5G can lead to several issues, including lengthy product development cycles, more expensive devices, and huge constraints on device industrial designs,” McQueen explains.
OEMs will have to rationalize the delegation of modem-RF system procurement to a handful of suppliers and, most importantly, make sure they pick the right partner. “Notably, it needs to be one with a well-proven, tested, or validated rich RFFE portfolio and a comprehensive 5G roadmap. The delegation brings several advantages, many of which have become increasingly stark as the device market transitions to 5G,” McQueen asserts.
To learn more about the complexities Smartphone OEMs are facing bring 5G to market, and to view the nine teardowns, download the whitepaper, “5G Teardowns Reveal Qualcomm’s RF Leadership Due to Growing Design Complexity”