Understand the future product mix and opportunity for 3-in-1 Embedded Subscriber Identity Modules (eSIMs) versus standalone eSIMs.
Measure the expected growth trajectory of 3-in-1 eSIM solutions.
Determine, from a chipset perspective, who is best positioned to take advantage of the 3-in-1 eSIM opportunity to help Original Equipment Manufacturers (OEMs) pick and prioritize potential partners and suppliers.
Understand market timelines to better gauge potential impacts on the standalone eSIM market.
Critical Questions Answered
What will be the total market size for 3-in-1 and standalone eSIMs over the next 5 years?
How, if at all, will this impact the standalone eSIM market?
Who is best positioned from a chipset vendor perspective?
Which OEMs are using 3-in-1 eSIM solutions now and who is expected to adopt them in the future?
What year will be considered the tipping point for 3-in-1 eSIM solutions?
Research Highlights
5-year standalone and 3-in-1 eSIM shipment and penetration forecasts.
3-in-1 eSIM shipments by consumer device type.
Secure Integrated Circuit (IC) ecosystem assessment accompanied by eSIM and Near Field Communication (NFC) market shares.
3-in-1 eSIM shipments by smartphone OEM.
Who Should Read This?
Strategy planners within the smart card and secure IC market and other organizations reliant on cellular connectivity and secure transactions.
Sales and marketing leaders looking to understand and benchmark organizational performance.
Other ecosystem players working in strategy, sales, and marketing capacities, including Mobile Network Operators (MNOs) and Mobile Virtual Network Operators (MVNOs) looking to understand the Total Addressable Market (TAM) size as it relates to 3-in-1 eSIM.
OEMs who are looking to understand 3-in-1 eSIM benefits and identify potential supplier partners.