The wireless device market is evolving rapidly, driven by advances in multi-protocol connectivity technologies like Wi-Fi, Bluetooth®, 802.15.4, and UWB. These innovations are enabling groundbreaking applications across consumer, enterprise, and industrial sectors—enhancing performance, reducing power consumption, and delivering smarter, faster devices with unprecedented features like positioning and sensing.
The Ceva-Waves Links™ family provides a comprehensive suite of wireless connectivity and processing solutions designed to help chipset vendors and OEMs meet the growing demands of the connected Edge AI device market. With Ceva’s cutting-edge solutions, companies can reduce the risk and investment needed to integrate multi-protocol connectivity into their products and accelerate their path to market.
What's Inside the Whitepaper:
- Market evolution and opportunities for Wi-Fi, Bluetooth®, 802.15.4, and UWB
- The growing need for multi-protocol connectivity solutions
- Benefits and opportunities of multi-protocol ICs across key verticals
- Accelerating the multi-protocol chipset market
